Space constraints within portable communication devices such as mobile phones, PDA’s, Bluetooth receivers, wireless modems and mobile broadband are driving the need for smaller and thinner packaging solutions to support increased performance and functional integration in a lower vertical profile.
As a result, the communication market is one of the fastest changing segments of the semiconductor industry and it has a significant impact on semiconductor packaging and testing technology.
Integration technology is now widely used, and can be found in a range of devices, from mobile applications to fixed networking communication equipment. 3D solutions like stacked die, stacked packages and multi-chip packages have contributed to increased product miniaturization and savings in board level real estate.
STATS ChipPAC offers a wide variety of advanced 3D packages for communication customers, customizing different functional blocks of multiple devices using the most cost effective solution.
Find out how STATS ChipPAC can support your Communication applications needs