STATS ChipPAC’s Korean operation provides a full range of integrated services ranging from initial package design to final test and burn-in. The state-of-the-art 2,445K ft² (227K m²) operation is strategically located in the Yeongjongdo development area of the Incheon Free Economic Zone (IFEZ) which is approximately 50 km from Seoul and close to the Incheon International Airport.
Focus on Advanced Technologies
STATS ChipPAC Korea has a strong focus on high end, advanced packaging technologies including:
Complex multi-die packages and 3D packaging with an emphasis on die stacking
System-in-Package (SiP), Package-on-Package (PoP) and Package-in-Package (PiP)
High end Flip Chip
PBGA with finer bond pitch and higher pin count with heat spreaders
System Level Test Center of Excellence
STATS ChipPAC combines operational efficiencies with proven test capabilities to achieve the lowest cost of test with the highest possible throughput and faster time-to-market. STATS ChipPAC Korea is a test center of excellence for system level test to support advanced SiP solutions.
Research and Development
STATS ChipPAC’s Korean operation is also the primary R&D Center for complex Stacked Die, Flip Chip interconnect, PiP, PoP and advanced SiP solutions.
• ISO 9001
• ISO 14001
• IATF 16949
• OHSAS 18001
• Sony Green Partner
• ESD S2020