Established in 1994 as the first Outsourced Semiconductor Assembly and Test (OSAT) provider in Singapore, STATS ChipPAC Singapore (SCS) offers back-end manufacturing services for the semiconductor industry. SCS’s state-of-the-art facility, at 808,000 square feet, is the largest OSAT operation in Singapore, and offers a full suite of assembly solutions to meet our customer’s IC packaging needs, from a wide array of advanced leadframe (QFN) and laminate based products (PBGA, PBGA-H, FBGA, LGA), to innovative wafer level packaging technologies.
SCS is STATS ChipPAC’s centre of excellence for wafer level packaging (WLP) for advanced mobile devices, including Fan-out WLP (FOWLP), Fan-in WLP and other 2.5D and 3D advanced wafer level technologies such as Through Silicon Via (TSV) and Integrated Passive Devices (IPD). SCS’s wafer level services also include full service wafer bumping (WLB) with options for repassivation, redistribution and IPDs.
The Singapore operation is also a center of excellence for testing high-end RF and mixed signal devices as well as high-speed digital devices. SCS provides a broad and comprehensive test capability in support of a broad range of package types, and is a full service provider for wafer sort, final package test, strip test, wafer bump and all wafer level products.
• ISO 9001
• ISO 14001
• ISO / TS16949: 2002
• OHSAS 18001
• Sony Green Partner
• ESD S2020