JCET Announces English Name Change to JCET Group Co., Ltd.

Jiangyin, November 18, 2019 – JCET announced it has received Shareholder approval to change its English name from Jiangsu Changjiang Electronics Technology Co., Ltd. and Jiangsu Changdian Technology Co., Ltd. to JCET Group Co., Ltd.  Founded in 1972, JCET is an Outsourced Semiconductor Assembly and Test (OSAT) company headquartered in Jiangyin, China. Through organic growth and acquisitions, JCET has become a leading international semiconductor company with the third largest revenue in the global IC packaging and test industry. As part of its global brand strategy, the change of the English name will enable JCET to establish a more outstanding corporate image that is a better fit for the company’s market strategy and business development needs. This name change will not affect the company’s operations. The rights and obligations of all customers and partners of JCET will also remain intact.

About JCET Group
JCET Group is a leading global semiconductor packaging and test provider, offering a full range of turnkey services that include semiconductor package design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications including mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Package, flip chip and wire bonding technologies. JCET Group has three R&D centers, six manufacturing locations in China, Singapore and Korea, and sales centers around the world providing close technology collaboration and efficient supply-chain manufacturing to customers in China and throughout the world.

Media Contact:
Christopher Stai
Tel: (209) 534-6398
Email: cstai@statschippac.com