Manufacturing Facilities

STATS ChipPAC Ltd. (SCS)
5 Yishun Street 23
Singapore 768442
Tel: +65-6824-7888

Established in 1994 as the first Outsourced Semiconductor Assembly and Test (OSAT) provider in Singapore, STATS ChipPAC Singapore (SCS) offers back-end manufacturing services for the semiconductor industry. SCS’s state-of-the-art facility, at 808,000 square feet, is the largest OSAT operation in Singapore, and offers a full suite of assembly solutions to meet our customer’s IC packaging needs, from a wide array of advanced leadframe (QFN) and laminate based products (PBGA, PBGA-H, FBGA, LGA), to innovative wafer level packaging technologies.

SCS is STATS ChipPAC’s centre of excellence for wafer level packaging (WLP) for advanced mobile devices, including Fan-out WLP (FOWLP), Fan-in WLP and other 2.5D and 3D advanced wafer level technologies such as Through Silicon Via (TSV) and Integrated Passive Devices (IPD). SCS’s wafer level services also include full-service wafer bumping (WLB) with options for re-passivation, redistribution, and IPDs.

The Singapore operation is also a center of excellence for testing high-end RF and mixed-signal devices as well as high-speed digital devices. SCS provides a broad and comprehensive test capability in support of a broad range of package types and is a full-service provider for wafer sort, final package test, strip test, wafer bump, and all wafer level products.

• ISO 9001
• ISO 14001
• ISO / TS16949: 2002
• OHSAS 18001
• Sony Green Partner