Archive for category: White Papers

Warpage Mitigation Processes in the Assembly of Large Body Size Mixed Pitch BGA Coreless Packages for Use in High Speed Network Applications [2013]

January 4, 2019/in White Papers /by JCET

A Study on the Electrical Characteristics of Different Wire Materials [2013]

January 4, 2019/in White Papers /by JCET

Electrical-Thermal Characterization of Wires in Packages [2014]

January 4, 2019/in White Papers /by JCET

Study of Intermetallic Compound Growth and Failure Mechanisms in Silver Bonding Wire Reliability [2014]

January 4, 2019/in White Papers /by JCET

Behaviors of QFN Package on a Leaframe Strip [2016]

January 4, 2019/in White Papers /by JCET

Electromigration for Advanced Cu Interconnect and the Challenges with Reduced Pitch Bumps [2014]

January 4, 2019/in White Papers /by JCET

Optimization of Compression Bonding Processing Temp for Fine Pitch Cu Col Flip Chip Devices [2014]

January 4, 2019/in White Papers /by JCET

Design and Stress Analysis for Fine Pitch Flip Chip Packages with Cu Column Interconnects [2014]

January 4, 2019/in White Papers /by JCET

Advanced Flip Chip Package on Package [2016]

January 4, 2019/in White Papers /by JCET

Fine Pitch Cu Pillar with BOL Assembly Challenges for High Performance Flip Chip Package [2016]

January 4, 2019/in White Papers /by JCET