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JCET2019-01-04 18:22:462019-01-11 22:45:56Warpage Mitigation Processes in the Assembly of Large Body Size Mixed Pitch BGA Coreless Packages for Use in High Speed Network Applications [2013]
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JCET2019-01-04 18:21:522019-01-11 22:46:35A Study on the Electrical Characteristics of Different Wire Materials [2013]
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JCET2019-01-04 18:20:512019-01-11 22:46:50Electrical-Thermal Characterization of Wires in Packages [2014]
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JCET2019-01-04 18:20:112019-01-11 22:47:04Study of Intermetallic Compound Growth and Failure Mechanisms in Silver Bonding Wire Reliability [2014]
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JCET2019-01-04 18:19:202019-01-11 22:47:20Behaviors of QFN Package on a Leaframe Strip [2016]
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JCET2019-01-04 18:18:402019-01-11 22:47:33Electromigration for Advanced Cu Interconnect and the Challenges with Reduced Pitch Bumps [2014]
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JCET
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JCET2019-01-04 18:17:302019-01-11 22:47:46Optimization of Compression Bonding Processing Temp for Fine Pitch Cu Col Flip Chip Devices [2014]
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JCET2019-01-04 18:16:532019-01-11 22:47:55Design and Stress Analysis for Fine Pitch Flip Chip Packages with Cu Column Interconnects [2014]
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JCET2019-01-04 18:16:042019-01-11 22:48:04Advanced Flip Chip Package on Package [2016]
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JCET2019-01-04 18:15:252019-01-11 22:48:11Fine Pitch Cu Pillar with BOL Assembly Challenges for High Performance Flip Chip Package [2016]
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