STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device.
STATS ChipPAC is wholly owned by Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). As the third largest OSAT in the world, the JCET Group of companies offer customers a comprehensive and broad product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), Through Silicon Via (TSV) and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea and customer support offices throughout Asia, the United States and Europe.
The JCET Group of companies includes Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP), also wholly owned by JCET. JCAP is the largest wafer bump and Wafer Level Chip Scale Packaging (WLCSP) provider in China with a broad set of capabilities including advanced wafer bump technology (copper pillar, gold and solder), wafer probe, WLCSP, Radio Frequency Identification (RFID), Encapsulated Chip Package (ECP) and Through Silicon Via (TSV) technology.
JCET is a publicly-traded company that is listed on the Shanghai Stock Exchange. For more information, visit www.jcetglobal.com.
For queries or requests regarding personal data which are in our possession, contact our Data Protection Officer, Rebecca Quah at +65 6824 7777.