USB Flash Drives

USB Flash Drives

USB Cards
STATS ChipPAC offers several USB flash drive options within its family of solutions for removable solid-state storage (RS3) applications. STATS ChipPAC’s USB options utilize bare die level assembly, pre-packaged die assembly or a combination of both. The USB module is an example of an integrated solution using NAND and controller die, while the SD-USB is an example of a package that uses bare and pre-packaged die. A majority of our card packaging processes are common with traditional packaging and leverage the most up to date technologies and processes unique to memory cards, including integrated curve-cutting, labelling, mechanical card assembly and card packaging. The key to maximizing the full value of packaging integration in removable solid-state storage devices is to provide a complete solution of design, test development, advanced packaging, memory test, card assembly and card test. STATS ChipPAC stands out in the outsourced semiconductor assembly and test market because of our focus on full turnkey services.

USB Module

STATS ChipPAC’s USB module design is an innovative Universal Serial Bus module for NAND flash memory applications, utilizing System-in-Package (SiP) and three dimensional (3D) die stacking technology to integrate NAND flash memory die, controller and passives onto a single packaging substrate for a cost-effective module solution. A typical USB drive design uses discrete NAND flash memory and controllers along with passives mounted onto a printed circuit board (PCB), thus consuming most of the usable area allowed by the form factor of the USB flash drive. On the other hand, the USB module can accommodate multiple die configurations and be customized depending on the requirements of the end application. Integrating all of the key components into a single package saves considerable space and allows for more effective signal routing at a lower overall cost.

Semiconductor manufacturers in the NAND flash memory market face an intense challenge to increase memory density within a limited form factor and deliver a competitively priced end product to consumers. Integrating the key components of a USB drive at the packaging level provides a number of benefits including increased design flexibility and advanced die stacking capability along with a reduction in size and overall cost. With our combined experience in memory card manufacturing, SiP and 3D integration technology and our advanced design capabilities, STATS ChipPAC can offer the USB module as a cost-effective NAND flash memory solution.

USB Flash Drive Formats

  • SD-USB
  • USB Module

Features

  • Custom body sizes to meet housing requirements
  • Traditional IC Packaging process flows
  • Wafer Backgrinding & Polishing
  • Surface Mount Technology
  • Die Stacking
  • Die Level & Pre-packed Memory supported
  • Die Attach with Epoxy & Film
  • Wire Bonding (Traditional, Reverse, FFL, etc.)
  • Vacuum Molding
  • Laser & Ink Marking
  • Singulation using Blade, WaterJet, Edge Grinder or Laser
  • Chamfering
  • Lid Attach using B-Stage Epoxy or Ultrasonic Welder
  • Mechanical Card Assembly
  • Label Attach
  • LED optional
  • High Speed Integrated Curve-Cutting
  • Lead-free & green materials set
  • Memory & Final Test capabilities

Applications

  • Digital Still & Video Cameras
  • Mobile Handsets
  • GPS Devices
  • PDAs, MP3 Players, etc.
 

 

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