White Papers

White Papers

Wafer Level Packaging Technologies
FOWLP eWLB Technology as an Advanced SiP Solution [2017] 下载
Innovative Integration Solutions for SiP Packages Using Fan-out WLP [2017] 下载
Reliability of eWLB for Automotive Radar [2017] 下载
28nm Chip-to-Package Interaction in Large Size eWLB [2017] 下载
Board Level Reliability of Automotive eWLB FOWLP [2016] 下载
Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor [2016] 下载
Board Level Reliability Improvement in eWLB Packages [2016] 下载
3D Integrated eWLB FOWLP Technology for PiP and SiP [2016] 下载
Challenges and Improvement of Reliability in Advanced Wafer Level Packaging [2016] 下载
Advanced 3D eWLB-PoP Technology [2016] 下载
Panel Level Advanced Packaging [2016] 下载
Advanced Wafer Level Technology Enabling Innovations [2015] 下载
Advanced 3D eWLB PoP Technology [2015] 下载
Modeling Correlation for Solder Joint_Fatigue Life Estimation in WLCSP [2015] 下载
Integration Through Wafer Level Packaging Approach [2015] 下载
Ultra Fine Pitch RDL Development in Multi-Layer eWLB Packages [2015] 下载
WLCSP+ and eWLCSP in FlexLine Innovative Wafer Level Package Manufacturing [2015] 下载
FlexLineTM - a Universal Wafer Level Platform for Fan-In and Fan-Out Designs [2014] 下载
Encapsulated WLCSP (eWLCSP) for Cost Effective and Robust Solutions in FlexLineTM [2014] 下载
Innovative Wafer Level Package Manufacturing with FlexLineTM [2014] 下载
FlexlineTM - A Flexible Manufacturing Method for Wafer Level Packages [2014] 下载
Automated Metrology Improves Productivity and Yields for Wafer Level Packages in HVM [2014] 下载
Solder Joint Fatigue Life Prediction in Large Size and Low Cost Wafer-Level Chip Scale Packages [2014] 下载
Encapsulated Wafer Level Package Technology (eWLCSP) [2014] 下载
Development of Exposed Die Large Body to Die Size Ratio Wafer Level Package Technology [2014] 下载
System-in-Package (SiP)
FOWLP eWLB Technology as an Advanced SiP Solution [2017] 下载
Microelectronics Innovative Integration Solutions for SiP Packages Using Fan-out WLP [2017] 下载
3D Integrated eWLB FOWLP Technology for PiP and SiP [2016] 下载
Advanced 3D eWLB-PoP Technology [2016] 下载
Advanced 3D embedded Wafer Level BGA PoP Technology [2015] 下载
Advanced Wafer Level Technology Enabling Innovations [2015] 下载
Design and Material Contributions to Second-Harmonic Nonlinearities in RF Silicon IPD [2014] 下载
TSV MEOL (Mid End of Line) and Packaging Technology of Mobile 3D IC Stacking [2014] 下载
Micro Electro-Mechanical Systems (MEMS)
Advanced Wafer Level Packaging of RF-MEMS with RDL Inductor [2016] 下载
Advanced Wafer Level Technology Enabling Innovations [2015] 下载
Flip Chip Interconnect
Fine Pitch Cu Pillar Assembly Challenges for Advanced Flip Chip Packages [2017] 下载
Fine Pitch High Bandwidth Flip Chip Package-on-Package Development [2017] 下载
Fine Pitch Cu Pillar with BOL Assembly Challenges for Low Cost and High Performance Flip Chip Package [2017] 下载
Large Flip Chip Assembly Challenges and Risk Mitigation Process [2017] 下载
10nm CPI Study for Fine Pitch Flip Chip Attach Process and Substrate [2017] 下载
Advanced Packaging for Automotive Dashboard Application [2017] 下载
Ultra-Thin Substrate Assembly Challenges for Advanced Flip Chip Package [2016] 下载
Thin Profile Flip Chip Package-on-Package Development [2016] 下载
Fine Pitch Cu Pillar with BOL Assembly Challenges for High Performance Flip Chip Package [2016] 下载
Advanced Flip Chip Package on Package [2016] 下载
Design and Stress Analysis for Fine Pitch Flip Chip Packages with Cu Column Interconnects [2014] 下载
Optimization of Compression Bonding Processing Temp for Fine Pitch Cu Col Flip Chip Devices [2014] 下载
Electromigration for Advanced Cu Interconnect and the Challenges with Reduced Pitch Bumps [2014] 下载
Wirebond
Behaviors of QFN Package on a Leaframe Strip [2016] 下载
Study of Intermetallic Compound Growth and Failure Mechanisms in Silver Bonding Wire Reliability [2014] 下载
Electrical-Thermal Characterization of Wires in Packages [2014] 下载
A Study on the Electrical Characteristics of Different Wire Materials [2013] 下载
Warpage Mitigation Processes in the Assembly of Large Body Size Mixed Pitch BGA Coreless Packages for Use in High Speed Network Applications [2013] 下载