Fine Pitch Ball Grid Array (FBGA)

STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate-based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology packaging solution for high performance and/or portable applications. The use of the latest materials and advanced assembly infrastructure produce a reliable and cost effective package. Lead free and halogen free compatible material sets are available. STATS ChipPAC’s FBGA is available in a broad range of JEDEC standard body sizes with LFBGA (<1.70mm [typically <1.40mm]), TFBGA (<1.20mm), VFBGA (<1.00mm), WFBGA (<0.80mm), UFBGA (0.65mm max.) and XFBGA (0.50mm max.) thickness.

STATS ChipPAC’s FBGA offering also includes stacked die options (FBGA-SD), including LFBGA-SD, TFBGA-SD, VFBGA-SD, WFBGA-SD and UFBGA-SD packages. STATS ChipPAC’s chip stack technology offers the flexibility of stacking 2 to 7 die in a single package. Die to die bonding capability enables device and signal integration to improve electrical performance and reduce overall package I/O requirements. Wafer thinning technology, overhang wire bond technology and the use of spacers between stacked die provide the flexibility to stack almost any desirable configuration of die in one package. This capability uses existing assembly infrastructure, which results in more functional integration with lower overall package cost. The use of the latest packaging materials allows this package to meet JEDEC Moisture Resistance Test Level 2a with lead-free reflow conditions. This is an ideal package for integrating memory for mobile phones. It is also used to integrate logic and memory, logic and analog, or combinations of memory, logic, analog and RF.

Features (general)

  • Thin, lightweight, array molded, cost effective, space-saving package solution
  • Available in 1.40mm (LFBGA), 1.20mm (TFBGA), 1.00mm (VFBGA), 0.80mm (WFBGA), 0.65mm (UFBGA) and 0.50mm (XFBGA) maximum thickness
  • Laminate substrate-based package which enables 1, 2, 3 and 4 layers of routing flexibility
  • Multiple routing layers and dedicated ground/power planes available for improved electrical performance BT laminate materials (1, 2, 3 and 4 metal layers)
  • Flexible body sizes range from 3mm x 3mm to 23mm x 23mm with square or rectangular body size options
  • 0.4mm to 1.0mm ball pitch; smaller ball for reduced height
  • Eutectic and Pb free solder balls
  • Green package available
  • JEDEC standard compliant

Features (stacked versions)

  • Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution
  • 2 die to 7 die stack with spacer capability
  • Flexible die stacking options ("pyramid," "same die," etc.)
  • Memory, Logic, Analog and RF device combinations
  • Capability to integrate discrete passives or integrated passive devices
  • Package height at 0.65, 0.80, 1.0, 1.2, 1.4 and 1.7mm max.
  • Die thinning down to 40um
  • Low loop wire bonding; reverse and die to die
  • Up to 2mm die overhang per side
  • Film spacer capability for decreased die stack thickness
  • Very thin substrate capability
  • Halogen-free and low-K wafer compatible BOM


  • Microprocessors/Controllers
  • Wireless RF
  • Analog
  • ASIC
  • Memory
  • Simple PLDs
  • Others

The stacked version is suitable for a variety of applications including memory integration, chipset integration (Analog/Digital), mixed technologies integration (baseband/RF), handheld products (cellular phones, gaming, MP3 players, GPS), consumer electronics (internet applications, digital cameras) and other applications requiring device integration in minimal form factors.  


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