Stacked Die Thin Small Outline Package (TSOP-SD)

TSOP  STATS ChipPAC offers the Thin Small Outline Package (TSOP). Reliability and thin profile are key TSOP attributes using surface mount technology (SMT). TSOP is available in a thermally enhanced version (TSOP-ep), as well as a stacked die version (TSOP-SD). Die stacking is available from 2 to 4 die, with bonding pads on two sides of the die or single-sided bonding pads. STATS ChipPAC uses the latest leadframe technology and state of the art design and simulation tools to achieve optimum electrical and thermal performance. STATS ChipPAC’s state of the art assembly facility and proven materials assure high yield manufacturing and long term reliability.


  • Two body sizes available in TSOP type 1 version
  • Lead counts: 48 and 56
  • Lead pitch: 0.50mm
  • Wide range of open tool die pad sizes available; custom size available
  • Moisture sensitivity: JEDEC Level 3
  • JEDEC standard compliant
  • Lead-free (Pb free) and green material sets available
  • Copper and alloy 42 leadframes available
  • Die stacking available up to 4 die

End Applications

  • Memory
  • RF / Wireless
  • Logic and Linear
  • End applications including portable electronics, pagers, memory modules and networking equipment


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