Stacked Packages

Stacked Packages


Package Level Integration with Die and Package Stacking




The types of 3D packages are often characterized by how they are stacked, as chips, packages or passives. Stacked Die Packages consist of bare die stacked and interconnected using wire bond and flip chip connections in one standard package. The choice of the 3D packaging type is determined not only by the needs of the final product including footprint, profile and cost but the business model of procurement, assembly and ownership of the final module and the value added of the integration.

STATS ChipPAC offers a broad portfolio of stacked die and stacked packaging solutions:

Standard Stacked Packages Advanced Stacked Packages
FBGA-SD PoP
FLGA-SD Fan-In PoP
PBGA-SD PiP
LQFP-SD, TQFP-SD Flip Chip PiP
TSOP-SD  

 



 

 

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