Low Profile Quad Flat Pack (LQFP)

STATS ChipPAC’s LQFP is a low profile (1.4mm) version of the QFP. The LQFP is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The LQFP offers pin counts up to 208, and is suitable for designs with high I/Os while meeting low profile requirements. They are used for mainstream cost sensitive applications.

STATS ChipPAC also offers the LQFP in an Exposed Pad configuration (LQFP-ep). This is a thermally enhanced version of the LQFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding, if needed. This enhanced thermal package is made possible by a deep downset die pad leadframe design.

LQFP is also available in stacked configurations: LQFP-SD and LQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance. STATS ChipPAC’s chip stacking technology allows the integration of multiple ICs within a single package to improve package performance and functionality while reducing overall package size and cost. The die to die wire bonding capability enables device/signal integration to improve electrical performance and reduce overall package I/O requirements. LQFP-SD, with nominal package thickness of 1.40mm, is suitable for a variety of product applications.

Features (general)

  • Body Sizes: 7 x 7mm to 28 x 28mm
  • Package Height: 1.4mm
  • Lead Counts: 32L to 208L
  • Lead Pitch: 0.80mm to 0.40mm
  • Available in gold or copper wirebond versions
  • Wide range of open tool leadframe and die pad sizes available.
  • Lead-free, Green and Low Alpha materials sets available
  • Moisture Sensitivity: JEDEC Level 3
  • JEDEC standard compliant

Features (stacked versions)

  • Combining devices into one package reduces PCB real estate and cost
  • Options for mixed technologies, 2 or more stacked dice
  • Increased sub-system performance by integrating multiple chips into a single package
  • Die to die bonding capability for device/signal integration
  • Fine pitch bonding capability
  • Exposed pad provides enhanced thermal performance
  • Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD)
  • Pin counts from 32 to 144 leads for LQFP-SD and 100 to 164 leads for LQFP-ep-SD


  • 3D Graphics
  • Multimedia
  • PC Chipsets
  • Video / Audio
  • Telecom
  • Disc Drives
  • Communication Boards (Ethernet, ISDN

The LQFP-SD is suitable for a variety of applications including memory integration (ASIC or Logic), chipset integration (Analog/ Digital), mixed technologies integration (Baseband/RF), handheld products (Cellular Phones, Pagers, MP3 Players, GPS), consumer electronics (Internet applications, Digital Cameras/Camcorders), computers (Network PCs), and PC peripherals (Disk Drivers, CD-R/RW, DVD Drivers).  


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