Test Services

Wafer Sort

STATS ChipPAC offers full service Wafer Sort production lines handling 300mm (12 inch), 200mm (8 inch) or 150mm (6 inch) wafers.

Turnkey Wafer Sort Services

STATS ChipPAC turnkey solutions provide the greatest value at the lowest cost. Working with a single supplier with a proven quality record also greatly simplifies your job. Full turnkey becomes even more attractive for stacked packages where the cost of a failure at package test can be multiplied by the number of die in the package, since all die in the package must be scrapped along with the one bad die.

KGD Solutions

To avoid the high costs of a defect in a multi-die package requires a robust Known Good Die Wafer Sort solution with full test coverage at the wafer level across the product’s operating temperatures, so that all die are guaranteed to be good when assembled and tested in the final package and used in the final application.

STATS ChipPAC offers proven Known Good Die test solutions to complement its leadership in stacked die and advanced packaging solutions that minimize the costs of testing these packages.

Wafer Probers

At the core of every Wafer Sort solution is a test platform and a prober. The following table highlights the primary probers used for Wafer Sort at STATS ChipPAC.

Manufacturer Model
TEL P12 (300mm) & P8 (200mm)
Semics Opus II (300mm) & Opus I (200mm)
TSK UF300 (300mm) & UF200AL (200mm)

Other types of probers are available at STATS ChipPAC factories to satisfy special customer requests. Contact us to request other probers not highlighted in the table.

Wafer Sort Services

For testing of 300mm (12 inch), 200mm (8 inch) or 150mm (6 inch) wafers, STATS ChipPAC offers:
 
  • Clean room environments down to class 1K (1000 particles per ft3)
  • Thin wafer handling solutions
  • Hot temperature testing up to 150ºC
  • Wafer bake and bake retention services
  • 3 camera, 3D, automatic wafer inspection system for Known Good Die, bumped wafers and Wafer Level CSP die
  • Waffle pack for Known Good Die and bumped die
  • Tape and reel services for all Wafer Level Products
  • Shipping services for bumped wafers and Wafer Level Products in cassettes or canisters for thin wafers
  • Prober network for real-time data processing and wafer mapping

    For technical specifications, contact your STATS ChipPAC sales representative for a presentation of STATS ChipPAC’s Wafer Sort Technology Roadmap.

    Wafer Probe Services


    Standard Probe Services 
    Standard probe services offered by STATS ChipPAC include:
    • Cantilever probing up to 32 test sites in parallel
    • Vertical probing up to 32 test sites in parallel
    • 2 and 3 row staggered probing
    • Sampled probing to lower the costs of Wafer Sort
    • Probe card design, development and maintenance

    Wafer Sort Development Services
    In addition to probe card design and development, STATS ChipPAC’s Test Development Center offers a complete array of  development services for wafer testing. Learn more about these services.

    Wafer Bump Probing

    Complementing its dominance in advanced packaging and Wafer Level Products, STATS ChipPAC offers full service wafer bump production lines for 300mm (12 inch), 200mm (8 inch) or 150mm (6 inch) wafers.

    Services offered include:
    • Vertical buckling beam probing (Recommended)
    • Cantilever probing
    • Membrane probe for small ball geometries and RF
    • Multi-site bump probing up to 8 sites in parallel

    Benefits of Membrane Probing

    STATS ChipPAC recommends membrane probe for testing of RF die.
     
    Compared to cantilever or vertical probe, membrane probe provides higher signal fidelity during testing. This enables greater test coverage and at-speed testing at Wafer Sort, which reduces the failures passed on to Final Test.

    Maximizing test coverage at Wafer Sort is especially important for stacked die packages where the cost of an RF failure is multiplied by the number of die in the package.

    STATS ChipPAC also recommends membrane probe for extremely small pad sizes below 40um and extremely small staggered pad pitch below 22um.

    Laser Repair Services

    STATS ChipPAC offers the following equipment for performing laser cuts and repairs on a wafer.

    Manufacturer Model Wafer Sizes
    Electro Scientific Industries (ESI) 9820 300 mm (12 inch) and 200 mm (8 inch)
    Electro Scientific Industries (ESI) 9350 200 mm (8 inch)

    The ESI equipment uses a 1.3um wavelength laser to make laser cuts with a positioning accuracy of better than 0.20um (Model 9820) and 0.35um (Model 9350). It can also process wafers directly from cassettes to minimize wafer handling.

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