STATS ChipPAC Taiwan Semiconductor Corporation Factory Test Profile

• STATS ChipPAC Taiwan Semiconductor Corporation's 218,149 square foot operation features 153,600 square feet (14,400 square meters) of floor space dedicated to test operations
• More than 130 test platforms
• Class 10K purity for wafer sort
• Final Test and Wafer Test: 57,000 square feet (5.3K m2)

• Continuously controlled test environment:
  • Class 1 and class 10 purity for CMOS IMAGE Sensor (CIS) testing
  • Class 1K purity for wafer sort
  • Class 10K for final package testing

Test Operation Highlights

• Long established relationships with all major Taiwanese semiconductor foundries
• 24/7 on-site product engineering support
• Center of Excellence for wafer sort
• Center of Excellence for testing of light sensor devices such as CMOS Image Sensors
• Over 3 years experience testing bumped wafers
• Full service provider for light sensor device testing
• Full service provider for final testing
• Post test and drop ship services

Device Families

• Wireless (RF) devices
• Mixed signal devices
• Consumer optics devices: CIS, CCD and other light sensor devices
• High-speed digital devices
• Embedded memory devices

Quality Certifications

• ISO 9001
• TS 16949
• IECQ
• ISO 14001
• OHSAS 18001