STATS ChipPAC Korea Factory Test Profile

• STATS ChipPAC's Majang-myeon Korean operation features 85,000 square feet (7.9K square meters) of floor space dedicated to test operations
  • Post Test area and Warehouse: 28,000 square feet (2.6K square meters)
  • Class 10K purity for wafer sort
  • Final Test and Wafer Test areas: 57,000 square feet (5.3K square meters)

• Continuously controlled test environment:
  • Class 1K for wafer testing
  • Class 10K for final package testing

Test Operation Highlights

• Full service provider for wafer testing
• Full service provider for final testing
• Center of Excellence for testing of advanced packages with Known Good Die (KGD): stacked die, stacked packages and other wafer level products
• Center of Excellence for testing SDRAM memory products
• Established best practices for Flash memory testing of multi-level cell devices (NAND)
• Center of Excellence for System Level Testing (SLT)
• Full turnkey test services for wafer bump and all wafer level products
• 24/7 on-site product engineering support
• Full service provider for Burn-In
• Test Program Development and Conversion capability
• Post Test and Drop Ship services

Device Families

• Wireless (RF) devices
• Mixed signal devices
• High speed digital devices
• All types of memory devices

Quality Certifications

• ISO 9001
• ISO 14001
• ISO/TS 16949
• OHSAS 18001
• Sony Green Partner