STATS ChipPAC Shanghai Factory Test Profile

• STATS ChipPAC’s 983,276 square foot Shanghai operation features two test floors with a total of 110,000 square feet (10,200 square meters) of floor space dedicated to test and wafer probe operations.
• More than 100 test platforms
• Continuously controlled test environment:
  • Class 1K and class 10K purity for wafer sort
  • Class 100K purity for final package test

Test Operation Highlights

• Largest test subcontractor in China
• Specializing in low cost test solutions at world class levels of quality and performance
• Center of Excellence for testing of Flash memory devices, both single-level cell devices (NOR) and multi-level cell devices (NAND)
• Established best practices in RF testing from Center of Excellence in RF testing (STATS ChipPAC Singapore)
• Established best practices in NAND memory testing from Center of Excellence in NAND testing (STATS ChipPAC Singapore)
• Extensive experience with high throughput test solutions including:
  • Matrix Pick & Place, 640 sites parallel test solution currently running in production
  • Gravity feed, 8 site parallel test solution currently running in production
• 24/7on-site product engineering support
• Full service provider for wafer testing
• High volume production lines for gold bumping on 200mm wafers
• Full service provider for final testing
• Post test and drop ship services

Device Families

• Wireless (RF) devices
• Mixed signal devices
• Digital devices
• Automotive devices
• Power management devices
• Memory devices: EEPROM and Flash

Quality Certifications

• ISO 9001
• ISO 14001
• TS 16949
• OHSAS 18001
• Sony Green Partner