• STATS ChipPAC’s 463,000 square foot Bangkok operation features 82,206 square feet dedicated to test operations (7,640 square meters), and includes three test floor areas dedicated to test, wafer probe and post test.
• More than 150 mixed signal and digital ATEs: Teradyne A580, Catalyst, Tiger, UltraFlex, Agilent 93K, Credence and Advantest
• Controlled test environment:
  • Class 10K purity for wafer probe (2,200 square meters)
  • Class 100K for final package testing (5,440 square meters)

Test Operation Highlights

• Full wafer bump probe and wafer probe capability (200mm and 300mm probers)
• Full leaded, MLF and FBGA package testing (Gravity feed and Pick and Place handlers)
• Excellence in mixed signal testing for Read Channel, SoCs (System-on-Chip): Dual sites and Quad sites
• Excellence in Pre-amplifier Bump products testing
• Excellence in mixed signal testing for Mobile products
• 32x2 sites DRAM package testing
• Post test and drop ship services
• 24/7 manufacturing services

Device Families

• Storage products
• Mobile products
• Power supplier control
• Network
• Pre-amplifiers
• DRAM
• Digital Devices

Quality Certifications