Test Services

Test Development Services

STATS ChipPAC provides customers with test development and test program migration services.  Our capabilities include:

  • Design for Manufacturing (DFM) consultation
  • Test program development, debug and validation
  • Device characterization
  • First silicon characterization (wafer test)
  • Test program optimization including test time optimization
  • Probe card design, fabrication and qualification (wafer test)
  • Load board design, fabrication and qualification (final test)
  • Design, fabrication and qualification of any other interfacing hardware (final test)
  • Multi-site migration to higher parallel testing
  • Test program migration to a different test platform

Included with these services are any test program changes required to rapidly maximize and stabilize first pass yields for high volume production.

Test Development Flow



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