Post Test Services
For STATS ChipPAC, every stage in the manufacturing process is critical, including Post Test. Consequently, STATS ChipPAC has established highly-automated Post Test systems to achieve extremely high throughput while maintaining a zero defects standard of quality.
STATS ChipPAC has achieved this goal by working closely with technology leaders in vision inspection, Final Marking and Tape and Reel systems to integrate these Post Test functions into a fully-automated Post Test process that maximizes throughput while minimizing manual handling. Integrated within this process is automatic 3D (top, bottom and sides) inspection of every device package to eliminate any packaging flaws before the devices are shipped to the end customer.
Each Post Test service is presented below, but it is important to realize that many of these services are performed on the same equipment, seamlessly integrating these services within a fully automated manufacturing process. For instance, it is common at STATS ChipPAC for Tape and Reel equipment to include a built-in 3D vision inspection system. Even Final Marking can be performed on the same Tape and Reel equipment.
Unless specifically stated otherwise, the following services apply to all devices and all types of packages arriving from Final Test in trays or tubes.
Final Marking
STATS ChipPAC provides Final Marking services for customers who require multiple good bins to segregate their good units based on performance such as speed grading their devices. These services include:
- Final laser mark to in-tray devices
- Final ink mark to in-tray devices
- Final laser mark to in-tube devices
- Re-work ink mark for mold packages (using black top method)
Baking
STATS ChipPAC uses large capacity ovens in a fully automated baking process with built-in oven control systems that control and monitor the entire bake cycle. This system automatically tracks the baking process until the lot completes the dry packing cycle and generates a moisture exposure tracking report at the end of the cycle.
3D Vision Inspection Systems
STATS ChipPAC performs 100% 3D inspection of every device using automatic scanners that check for planarity (warpage), pitch, orientation, marking and package dimensions.
STATS ChipPAC also offers the capability to correct and re-inspect small defects in good devices to minimize waste (disposal of recoverable devices) at Post Test.
Tape and Reel
STATS ChipPAC provides 100% taping and de-taping capability. High speed tape and reel services are available for most package types to avoid late shipments due to bottlenecks at Post Test. STATS ChipPAC continually replaces its older Tape and Reel systems with highly integrated Tape and Reel systems that include many of the services highlighted above to provide the highest possible throughput at the highest possible quality level.
Custom Post Test Solutions
STATS ChipPAC also has the expertise and flexibility to support custom Post Test solutions requested by customers, such as serialization of units and special IT data management requirements. As a service provider, STATS ChipPAC designs into its standard manufacturing processes the capability for flexibility to quickly support special requests from customers.
Packing
In its mission to eliminate the possibility of mistakes in Post Test, STATS ChipPAC uses automated visual aid systems to display a customer’s specified packing method and bill of materials. Label generation is also fully automated including the automatic generation of device-dependent, Moisture Sensitivity Levels (MSL) labels.
By default, STATS ChipPAC uses vacuum aluminum packing bags with bar code labeling, but can also support custom requirements.
Drop Ship
Drop ship means that STATS ChipPAC’s customers do not need to bear the expenses of maintaining inventory at their own facilities. STATS ChipPAC can instead ship your final products directly to your end customers. Of course, you can also choose to have STATS ChipPAC ship your final products to your own facility.
Contact us to discuss the Post Test services available for your package type at your chosen STATS ChipPAC factory.