Test Services Overview
Semiconductor chips are rapidly increasing in complexity, requiring more advanced test systems and capabilities. We provide customers with a full suite of test platforms and engineering services to support a broad range of mixed signal, Radio Frequency (RF), analog and high-performance digital semiconductor devices. Our full turnkey test services, which include wafer bump, probe, final test and post test, deliver the lowest cost of test for our customers with the highest possible throughput and faster time-to-market.
From its foundation of factories worldwide, STATS ChipPAC provides a full-service orchestration of best-in-class test services and capabilities at cost-effective pricing:
- Front-end test development services and test consultation services
- Wafer test, including testing of bumped wafers and known good die (KGD) solutions for assembly of stacked die into a single package
- Final testing of simple and advanced packages using advanced test technology and automatic control of the test process that restricts yield losses to hard failures in the silicon itself
- A full suite of optimized post test services for rapid delivery of the final products to the end customer
The entire test process is established within a rigid framework of zero-defects quality assurance that delivers peace of mind to all STATS ChipPAC customers.
Lowest Cost of Test
STATS ChipPAC combines operational efficiencies with its proven capabilities and competency to achieve the lowest cost of test (COT) with the highest possible throughput.
Test Solutions Partner
By engaging STATS ChipPAC early in the product development process, customers benefit from STATS ChipPAC’s experience and guidance for a rapid, predictable and problem-free production ramp.