Wafer Level Products
STATS ChipPAC offers a full suite of Wafer Level Processing Solutions
Wafer Level Packaging OptionsSTATS ChipPAC offers wafer level processing technologies for the following package options:
eWLB (embedded Wafer Level Ball Grid Array)
WLCSP (Wafer Level Chip Scale Packages)
Flip Chip Packages
CSMP (Chip Scale Module Packages)
IPD (Integrated Passive Devices)
STATS ChipPAC’s Wafer Level Processing (WLP) services include full service wafer bumping with options for wafer repassivation, redistribution and IPD layers with polyimide dielectric with the solder alloy selection flexibility of a printed paste solder bump technology. This internal wafer bumping capability enables full turnkey WLCSP and advanced Flip Chip assembly and test. For larger pitch applications, either printed paste bumping or mechanical ball drop are available. Additionally, a complete, flexible backend assembly capability allows for high volume wafer sorting, automatic optical inspection and backend processing into bare die in tape and reel or waffle pack.
Full Turnkey Wafer Level Services at STATS ChipPAC
With our unmatched strength in wafer bump, test and die level services, STATS ChipPAC is uniquely positioned to provide full turnkey wafer processing to our customers. We can lower both cost and cycle time by offering a broad spectrum of wafer bumping related processes, including:
- wafer bumping and redistribution services
- full turnkey services for embedded Wafer Level Ball Grid Array (eWLB) applications
- full turnkey services for advanced Flip Chip applications
- full turnkey services for Wafer Level Chip Scale Packages (WLCSP)