System-in-Package (SiP)
STATS ChipPAC’s
System-in-Package, also known as
SiP, is a substrate based package with one or more IC’s, multiple passives and other surface mount components with plastic overmolded encapsulation. The use of advanced assembly techniques, such as flip chip, die stacking or a combination of both, allows mixed technology IC’s and other components to be combined in a cost effective and reliable package with minimal footprint and maximum functionality. In addition, this package can be built either as a Land Grid Array or Ball Grid Array to match the application or thermal/electrical design requirements.
Advantages
SiP is an excellent alternative to SoC (System-on-Chip). SoC can be difficult to design and build as different functions are combined on one fab technology. SiP can combine multiple die (manufactured using different wafer fabrication processes) without performance tradeoffs, reducing time to market, development costs and expanding the supply chain.
SiP also provides an excellent solution for ease of system level manufacturability and design. By including critical components into the SiP package and moving routing to the SiP, the system complexity, size and component placements can be reduced.
Features
- Body sizes up to 50 x 50mm
- Flexible ball and land grid arrays
- Lead-free and green materials set
- Multiple routing layers and dedicated ground/power planes available for improved electrical performance
- BT laminate materials, Si backplane
- JEDEC standard compliant
Applications
- RF/Wireless: Power amplifiers, baseband, transceiver modules, BluetoothTM, GPS, UWB, etc.
- Consumer: Digital cameras, handheld devices, memory cards, etc.
- Networking/Broadband: PHY devices, line drivers, etc.
- Graphics processors