Thin Profile Quad Flat Pack (TQFP)
The
Thin Profile Quad Flat Pack (TQFP) belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP is the thinnest package in the QFP family. This thin package is made possible by a well controlled low loop wire bonding process and package warpage control during the molding process. TQFP is suitable for mainstream cost sensitive applications where thickness and weight are premium.
TQFP-ep
STATS ChipPAC also offers the TQFP in an Exposed Pad configuration
(TQFP-ep). This is a thermally enhanced version of the TQFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding, if needed. This enhanced thermal package is made possible by a deep downset die pad leadframe design.
Features
- Body Sizes: 12 x 12mm to 16 x 16mm
- Package Height: 1.0mm
- Lead Counts: 80L to 144L
- Lead Pitch: 0.50mm to 0.40mm
- Limited number of open tool leadframe and die pad sizes available
- JEDEC standard compliant
- Lead-free and Green material sets available
End Applications
- ASIC
- DSP
- Gate Array
- Logic/Microprocessors/Controllers
- Multimedia, PC Chipsets 3D Graphics