MQFP-ed

Exposed Drop-in Heat Slug Metric Quad Flat Pack (MQFP-ed)

STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad Flat Pack (MQFP-ed) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by adding a drop-in exposed anodized aluminum heat spreader during the molding process, using a standard leadframe. MQFP-ed typically has 60% higher thermal performance over the standard MQFP and the QFP-d for higher power applications.

Features

  • Body Sizes: 14 x 20mm to 32 x 32mm
  • Package Height: 3.4mm
  • Lead Counts: 100L to 240L
  • Lead Pitch: 0.80mm to 0.50mm
  • JEDEC standard compliant
  • Lead-free and Green material sets available

End Applications

  • ASIC
  • DSP
  • FPGA
  • PLD
  • Logic, microprocessors / controllers
  • High speed logic, high power microprocessors
  • 3D graphics, telecom, wireless, audio, CPU / GUI 3D Graphics