MQFP

Metric Quad Flat Pack (MQFP)



STATS ChipPAC’s Metric Quad Flat Pack (MQFP) is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The MQFP is targeted at cost sensitive applications while providing a high degree of thermal and electrical performance. Offered in a wide range of body sizes and pin counts, the MQFP provides designers with the flexibility and convenience of meeting their packaging needs for a large variety of device designs.

Features

  • Body Sizes: 10 x 10mm to 32 x 32mm
  • Package Height: 2.0mm to 3.4mm
  • Lead Counts: 44L to 240L
  • Lead Pitch: 0.80mm to 0.50mm
  • Wide range of open tool leadframe and die pad sizes available
  • Moisture Sensitivity: JEDEC Level 3
  • JEDEC standard compliant
  • Lead-free and Green material sets available
  • Copper and alloy leadframes available

End Applications

  • ASIC
  • DSP
  • Gate Array
  • Logic / Microprocessors / Controllers
  • Multimedia, PC Chipsets, Others