Low Profile Quad Flat Pack (LQFP)
STATS ChipPAC’s
LQFP is a low profile (1.4mm) version of the QFP. The LQFP is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The LQFP offers pin counts up to 208, and is suitable for designs with high I/Os while meeting low profile requirements. They are used for mainstream cost sensitive applications.
LQFP-ep
STATS ChipPAC also offers the LQFP in an
Exposed Pad configuration (LQFP-ep). This is a thermally enhanced version of the LQFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding, if needed. This enhanced thermal package is made possible by a deep downset die pad leadframe design.
Features
- Body Sizes: 7 x 7mm to 28 x 28mm
- Package Height: 1.4mm
- Lead Counts: 32L to 208L
- Lead Pitch: 0.80mm to 0.40mm
- Wide range of open tool leadframe and die pad sizes available. Custom sizes available.
- Moisture Sensitivity: JEDEC Level 3
- JEDEC standard compliant
- Lead-free and Green materials sets available
- Copper and alloy leadframes available
End Applications
- 3D Graphics
- Multimedia
- PC Chipsets
- Video / Audio
- Telecom
- Disc Drives
- Communication Boards (Ethernet, ISDN