QFNs-st

Quad Flat No-Lead Package (Stand-off Terminal): QFNs-st

STATS ChipPAC’s STATS ChipPAC’s Quad Flat No-Lead Stand-off Terminal (QFNs-st) package features a significantly higher number of I/O terminal pads than traditional QFN packages. Whereas QFP and QFN packages require 0.4mm pitch to accommodate more I/O, QFNs-st can accommodate more I/O with a more relaxed terminal pitch by virtue of allowing multiple rows. QFNs-st has the flexibility to accommodate multiple rows of terminals with either fixed or variable pitch which, in turn, enables board routing for various applications, thereby extending the application and pin count range of this cost effective QFN type package. The QFNs-st is a leadframe based, plastic encapsulated, chip scale packaging solution in molded array format (saw singulated). An exposed die pad coupled with extremely low RLC provides excellent electrical and thermal performance enhancements, and is especially suited for wireless, handheld portable, computing and storage applications. QFNs-st is available in various body sizes and thicknesses, has a green/lead-free bill of materials and can be mounted by conventional SMT equipment. Board level reliability and drop test have been proven for both mobile and computing applications.

Features

  • Saw singulated, stand-off terminal version
  • 25-50mm stand off
  • Body sizes: 6 x 6mm to 15 x 15mm
  • Square or rectangular body sizes
  • Leads on 4 sides of the body (QFN)
  • Lead pitch: 0.40 and 0.50 with other options available
  • Multi row lead design options
  • Thin package thickness options: 0.80 & 1.0mm
  • Pin counts from 52L up to 700L
  • High I/O configurations available (up to 700L, multi row)
  • Custom I/O configuration options available
  • Use of compression molding for long wire lengths
  • Leadframes are pre-plated (PPF)
  • Green materials set
  • Excellent thermal and electrical performance
  • Full in-house package and leadframe design capability
  • Full in-house assembly and test capability
  • In-strip testing ready
  • Full in-house electrical, thermal and mechanical simulation and measurement capability

End Applications

  • Computing and Storage
  • Telecommunications
  • RF
  • Analog and Linear
  • Logic
  • ASICs and DSP

Test Services

  • Product Engineering support
  • Probe capability
  • Program generation/conversion
  • Drop Ship available