QFN

Quad Flat No-Lead (QFN)

STATS ChipPAC’s Quad Flat No-Lead (QFN) and Dual Flat No-Lead (DFN) package offering includes QFNs (saw singulated), QFNp (punch singulated), VQFN, WQFN, UQFN, XQFN and QFN-dr. These are leadframe based, plastic encapsulated, chip scale packages in single mold cavity format (punch singulated) or molded array format (saw singulated).

An exposed die pad coupled with extremely low RLC provides excellent electrical and thermal performance enhancements which are ideal for high frequency and high power applications, and are especially suited for wireless and handheld portable applications such as cell phones.

QFN-dr with staggered dual row leads offers higher I/O counts. STATS ChipPAC’s QFN packages are currently available in various body sizes and thicknesses, offered in standard and green/lead-free bill of materials and can be processed by conventional SMT equipment, benefiting surface mount operations downstream.

Features

  • Body sizes: 2 x 2 to 12 x 12mm
  • Lead pitch: 0.40, 0.50, 0.65 and 0.80mm
  • Custom lead/pitch configurations available
  • Package profile heights: 0.45, 0.55, 0.75, 0.85 and 0.90mm
  • Option for non-exposed die pad
  • Green materials set
  • Option for PbSn, 100% matte Sn or PPF
  • Small chip scale design offers 50% reduction in board space (16L TSSOP vs. 16L QFN)
  • 33% weight reduction (in 16L TSSOP vs. 16L QFN)
  • Excellent thermal & electrical performance
  • Full in-house package and leadframe design capability
  • Full in-house assembly and test capability
  • Full in-house electrical, thermal and mechanical simulation and measurement capability
  • Wide range of open tool leadframe and die pad sizes available
  • JEDEC standard compliant (XQFN, UQFN, WQFN, VQFN)

End Applications

  • RF
  • Power management
  • Discretes
  • Analog/Linear
  • Logic
  • Applications requiring enhanced electrical and thermal performance and reduced package size, thickness and weight