BCC

Bump Chip Carrier (BCC)

STATS ChipPAC’s Bump Chip Carrier (BCC) technology produces a chip scale leadframe based molded package with bumps which are formed after the leadframe is etched away. An exposed die pad coupled with extremely low RLC provides excellent electrical and thermal performance enhancements which are ideal for high frequency and high power applications especially for handheld portable applications such as cell phones. The BCC is manufactured in a molded array format that maximizes product throughput and material utilization. The BCC is available with single row and dual row bumps in BCC++ and BCC+. Overall package profile height is 0.80mm maximum.


Features

  • Body sizes: 4 x 4mm to 9 x 9mm
  • Lead pitch: 0.50mm and 0.80mm
  • Custom body / lead / pitch configurations available
  • Package profile heights (overall): maximum 0.80mm
  • Both single row & dual row design
  • Ni / Pd / Au plated bumps
  • Excellent thermal and electrical performance
  • Full in-house package and leadframe design capability
  • Full in-house electrical, thermal and mechanical simulation and measurement capability
  • JEDEC standard compliantBody sizes: 2 x 2 to 12 x 12mm

End Applications

  • RF
  • Power management
  • Analog/Linear
  • Logic
  • Applications requiring enhanced electrical and thermal performance and reduced package size, thickness and weight