QFN & BCC Package Families
A comprehensive range of Quad Flat No-Lead and Bump Chip Carrier Package Solutions
| Package |
Configurations |
| QFN |
QFNp, QFNs, QFN-dr,
QFN-SD2, QFN-COL, fcQFN
UQFN, VQFN, WQFN, XQFN, DFN |
| BCC |
BCC, BCC+, BCC++ |
At STATS ChipPAC, we provide a comprehensive range of QFN and BCC package solutions. From single and dual row bumped chip carriers, to low profile, small and thin, thermally enhanced, dual, or quad flat leadless packages, STATS ChipPAC offers leadframe packages to meet your needs. STATS ChipPAC's QFN and BCC packages are available in a wide variety of body sizes, lead pitch and in standard and green / lead-free bill of materials.
Additionally, STATS ChipPAC's QFN and BCC packages are assembled using industry proven materials and technologies to ensure long term performance and reliability.