Memory Cards
STATS ChipPAC offers a variety of memory card formats in addition to value-added package assembly and test services. A majority of our card packaging processes are common with traditional packaging and leverage the most up-to-date technologies and processes unique to memory cards, including integrated curve-cutting, labelling, mechanical card assembly and card packaging. STATS ChipPAC provides solutions that utilize bare die level assembly, pre-packaged die assembly or a combination of both. The Micro-SD is an example of an integrated solution using NAND and controller die while the SD-USB is an example of bare die, pre-packaged die and SMT components. In addition to assembly, STATS ChipPAC offers memory and card test services, with dedicated test resources to support test development as required.
Memory Card Formats
- SD Card
- Mini SD
- Micro SD
- Memory Stick
- MS Pro Duo
- SD-USB
Features
- Body sizes up to 20 x 30mm
- Traditional IC Packaging process flows
- Wafer Backgrinding & Polishing
- Surface Mount Technology
- Die Stacking
- Die Level & Pre-packed Memory supported
- Die Attach with Epoxy & Film
- Wire Bonding (Traditional, Reverse, FFL, etc.)
- Vacuum Molding
- Laser & Ink Marking
- Singulation using Blade, WaterJet, Edge Grinder or Laser
- Chamfering
- Lid Attach using B-Stage Epoxy or Ultrasonic Welder
- Mechanical Card Assembly
- Label Attach
- High Speed Integrated Curve-Cutting
- Lead-free & green materials set
- Memory & Final Test capabilities
Applications
- Digital Still & Video Cameras
- Mobile Handsets
- GPS Devices
- PDAs, MP3 Players, etc.