Flip Chip Quad Flat No-Lead Package (fcQFN)
STATS ChipPAC’s Flip Chip Quad Flat No-Lead Package (fcQFN) combines the low and predictable parasitics of flip chip interconnection with the low cost of leadframes and the industry standard footprint of QFN packages, to provide a packaging solution that is ideally suited for high performance RF devices.
STATS ChipPAC’s Flip Chip packages are available in lead counts ranging from 8 to 72, body sizes from 2 x 2mm to 10 x 10mm, and square or rectangular package formats. This package also features a choice of exposed or encapsulate die pad options, which may be electrically connected or isolated, thus enabling a choice of thermal and electrical options.
Flip Chip interconnection provides the ultimate in miniaturization, reduced package parasitics and enables new paradigms in the area of power and ground distribution to the chip which are not feasible with other traditional packaging approaches. STATS ChipPAC offers full turnkey services ranging from design through production, including high speed, high pin count digital and RF testing.
Features
- Flip chip interconnection between die and leadframe fingers with overmolding (no underfill)
- Hi Pb bump or Au stud bump with Cu leadframes (Au stud version is a Pb-free package)
- Accommodates die up to 1mm less than package size
- Industry standard QFN footprint
- Supports body sizes ranging from 2 x 2mm to 10 x 10mm
- Pin counts range from 8–72 pins
- Readily achieves performance up to 40GHz through low interconnect parasitics
- Excellent thermal & electrical performance
- Option for non-exposed die pad
End Applications
- RF devices driven by need for low and predictable parasitics
- Power/analog and power management products by virtue of low on resistance
- Devices for wireless products such as RFICs and power ICs that require low parasitics, small form factor and low cost