Flip Chip Chip Scale Packages (fcCSP)
STATS ChipPAC’s
fcLFBGA and
fcLGA packages form a sub-group in the Flip Chip package family which represents the form factor popularly known in the industry as CSP (Chip Scale Package). The fcLFBGA and fcLGA are produced on substrates with matrix strip format and use overmolding and saw singulation processes similar to wire bond packages of the same form factors. The fcLFBGA is an overmolded package with solder balls, while the fcLGA is an exposed die product that does not have solder balls.
STATS ChipPAC’s Flip Chip CSP packages are available in ball counts ranging from 32 to 900, body sizes from 5 x 5mm to 15 x 15mm and various package formats.
Flip Chip interconnection provides the ultimate in miniaturization, reduced package parasitics and enables new paradigms in the area of power and ground distribution to the chip which are not feasible with other traditional packaging approaches. STATS ChipPAC offers full turnkey services ranging from design through production, including high speed, high pin count digital and RF testing.
Features
- Eutectic hi-Pb or Pb-free bumps
- Minimum overall height of 1.40mm for fcLFBGA; 1.00mm for fcVFBGA; 0.65mm for fcLGA
- Conventional 2 and 4 layer through-hole or laser laminate substrates
- Build-up substrates available
- 150um minimum die bump pitch for peripheral layout; 180um minimum die bump pitch for full array
- 0.50mm minimum package ball (BGA) or pad (LGA) pitch
- Body sizes 4 x 4mm through 15 x 15mm using same matrix strip format as wire bond LFBGA
- In-house wafer bumping for 6, 8 and 12 inch wafers including BCB and polyimide re-passivation and RDL option
End Applications
Devices for wireless and portable products such as RFICs and power/analog ICs driven by miniaturization and low package parasitics.