Flip Chip Ball Grid Array (fcBGA)
STATS ChipPAC’s high-end BGA Flip Chip packages include the fcBGA, fcBGA-SiP, fcBGA-H and fcBGA-MP. The fcBGA package is the main platform in this package sub-group, which also includes a thermally enhanced version with heat spreader (fcBGA-H) and a package subsystem meeting the standard BGA footprint that contains multiple components within the same package (fcBGA-MP).
STATS ChipPAC’s Flip Chip BGA packages are available in ball counts ranging from 32 to 2915, body sizes from 5 x 5mm to 55 x 55mm and various package formats.
Flip Chip interconnection provides the ultimate in miniaturization, reduced package parasitics and enables new paradigms in the area of power and ground distribution to the chip which are not feasible with other traditional packaging approaches. STATS ChipPAC offers full turnkey services ranging from design through production, including high speed, high pin count digital and RF testing.
Features
- High performance packages up to 55mm body size with >2900 pins, and thermal solutions ranging from 2 piece, 1 piece or no heat spreader
- ABF build up to 4-4-4 (5-2-5 in development) and 2L & 4L (1-2-1) laminate substrates with 400um thin core (200um core & coreless in development)
- Packaging solution for 40N node with Ultra low K die-electric (32N/28N in development)
- “Green” flip chip solution with Pb-free and Cu-column bump and halogen-free material sets
65N/Low K & 40N/ELK
Eutectic, high Pb, Pb-free, and Cu-column bumps
Nitride, Polyimide, BCB wafer passivations
Ni-Au, SOP (solder-on-pad), OSP (organic solder preservative), Ni-free SOP pad & immersion tin finish
Bumped wafer thinning down to 100µm
Wafer bumping for 200mm (printing) & 300mm plating) wafers; RDL for 200mm wafers
Seamless integration of flip chip, SMT & in-line open/short testing operations
F/A metrology tools for rapid diagnostics & debugging, including TDR, CSAM, X-ray, Ion milling & SEM
All packages qualified to JEDEC specifications and/or custom requirements based on end applications
End Applications
- ASIC and FPGAs requiring high pin counts & electrical performance
- CPUs driven by electrical performance
- GPU (Graphics Processing Units) requiring electrical performance & efficient on-chip power distribution
- PC chip sets and integrated graphics devices (IGP) driven by high I/O density