Flip Chip Ball Grid Array (fcBGA)
STATS ChipPAC’s high-end BGA Flip Chip packages include the fcBGA, fcBGA-SiP, fcBGA-H and fcBGA-MP. The fcBGA package is the main platform in this package sub-group, which also includes a thermally enhanced version with heat spreader (fcBGA-H) and a package subsystem meeting the standard BGA footprint that contains multiple components within the same package (fcBGA-MP).
STATS ChipPAC’s Flip Chip BGA packages are available in ball counts ranging from 32 to 1728, body sizes from 5 x 5mm to 45 x 45mm and various package formats.
Flip Chip interconnection provides the ultimate in miniaturization, reduced package parasitics and enables new paradigms in the area of power and ground distribution to the chip which are not feasible with other traditional packaging approaches. STATS ChipPAC offers full turnkey services ranging from design through production, including high speed, high pin count digital and RF testing.
Features
- Eutectic, high Pb & Pb-free bumps
- Nitride, Polyimide, BCB wafer passivations
- Ni-Au, SOP (solder-on-pad), OSP (organic solder preservative), Ni-free SOP pad & immersion tin finish
- Bumped wafer thinning down to 100um
- Wafer bumping for 200mm (printing) & 300mm (plating) wafers; RDL for 200mm wafers
- Seamless integration of flip chip, SMT and in-line open/short testing operations
- F/A metrology tools for rapid diagnostics & debugging, including TDR, CSAM, X-ray
- All packages qualified to JEDEC specifications and/or custom requirements based on end applications
End Applications
- ASIC and FPGAs requiring high pin counts & electrical performance
- CPUs driven by electrical performance
- GPU (Graphics Processing Units) requiring electrical performance & efficient on-chip power distribution
- PC chip sets and integrated graphics devices (IGP) driven by high I/O density