Flip Chip Packages
Flip Chip packaging, in which the silicon die is directly attached to the substrate using solder bumps instead of wire bonds, provides the most dense interconnect with the highest electrical and thermal performance. Flip Chip technology is used in a wide array of applications ranging from consumer products to highly sophisticated ASICs, PC chipsets, graphics and memory packages.
Flip Chip interconnection provides the ultimate in miniaturization, reduced package parasitics and enables new paradigms in the area of power and ground distribution to the chip, which are not feasible in other traditional packaging approaches.
Broad Portfolio of Flip Chip Packages
STATS ChipPAC’s Flip Chip portfolio ranges from large single die packages with passive components used for graphics and ASIC devices, to modules and complex three dimensional (3D) packages that contain logic, memory and radio frequency (RF) devices and that integrate flip chip and wire bonding interconnection within the same package. STATS ChipPAC’s Flip Chip packages are available in QFN, LFBGA, LGA, BGA, complex subsystem modules (fcBGA-MP) and complex 3D packages (SiP, MD, PiP).
Full Turnkey Flip Chip Services at STATS ChipPAC
With our unmatched strength in wafer level packaging, wafer probe and final test, STATS ChipPAC is uniquely positioned to provide full turnkey processing to our customers. STATS ChipPAC offers full turnkey flip chip services ranging from design through production, including high speed, high pin count digital and RF testing.