Extremely Thin Profile Array Packages (XBGA)
Space constrained portable electronics such as cell phones, mini disk drives, and miniaturized consumer electronics are driving the need for smaller and thinner packaging solutions to support low vertical profiles.
By combining conventional wire bond equipment and processes with advanced thinning technologies, STATS ChipPAC is able to offer a leading edge solution that still satisfies the cost sensitive demands of consumer applications: Extremely Thin Profile Array Packaging solutions. STATS ChipPAC’s extremely thin packages offer maximum profile heights less than 0.50mm.
While bare die solutions have typically been utilized for extremely thin profile requirements, STATS ChipPAC now offers the option of using a substrate based molded package for the same applications. These extra thin packages are able to accommodate die shrinks without changing the package footprint as well as integrate more than one device within the package.
In order to achieve a maximum profile height less than 0.50mm, STATS ChipPAC utilizes a 0.13mm two metal layer laminate substrate, wafer thinning down to 75 microns, advanced molding technology, and an optimized bill of materials to minimize warpage of the assembled package.
STATS ChipPAC’s extra thin design allows a full array of solder balls or lands on the substrate to deliver greater flexibility in input/output (I/O), layout and density in a given package size. STATS ChipPAC’s Extremely Thin Fine Ball Grid Array (XFBGA) package features a maximum height of 0.50 mm while the Extremely Fine Land Grid Array (X1FLGA) package achieves a maximum height of 0.45mm
Features
- Profile heights less than 0.5mm
- 0.25mm mold cap
- 75um die thickness
- 0.13mm substrate thickness (2 metal layer laminate substrate)
- Flexible body sizes ranging from 4 x 4mm to 15 x 15mm
- 0.80, 0.65 and 0.50mm ball pitch
- 50um solder bumping on substrate
- Utilizes conventional wire bond equipment and processes
- Wide range of custom and open tool designs available
- Pb-free material set options (including low alpha materials)
- JEDEC standard compliant
End Applications
- Space constrained portable electronics such as cell phones, mini disk drives, and miniaturized consumer electronics
- Memory cards and USB drives
- Stacked packages