TBGA

Tape Ball Grid Array (TBGA)

TBGA
STATS ChipPAC’s Tape Ball Grid Array Package (TBGA) is a cavity-down package that offers excellent electrical performance and thermal power dissipation in a low profile packaging alternative. The cavity down construction with the IC chip directly attached to an integrated copper heat spreader provides enhanced thermal performance. Two types of TBGA products are available: TBGA-I, a one-metal layer tape with floating heat spreader, and TBGA-II, a one-metal layer tape with grounded heat spreader. Electrical performance improvements are achieved through reduced signal trace and wire bond lengths, elimination of through vias, and the utilization of the heat spreader as an uninterrupted ground plane. Additionally, these packages are assembled using industry proven materials and technologies to ensure long-term performance and reliability.

Features

  • In-house package and substrate design capability
  • In-house electrical, thermal and mechanical simulation and measurement capability
  • Single layer polyimide tape based substrate offers fine pitch routability and high I/O density
  • Integrated copper heat spreader offers excellent thermal performance
  • Excellent thermal and electrical performance
  • Wide range of custom and open tool designs available
  • Body sizes ranging from 27mm x 27mm to 40mm x 40mm
  • Bump pitches from 1.0mm to 1.27mm
  • Ball counts ranging from 256 to 896
  • Eutectic and Pb-free BOM options available
  • Proven reliability
  • JEDEC standard compliant

End Applications

  • ASIC
  • DSP
  • Gate Array
  • Microprocessors / Controllers / Graphics
  • Memory
  • PC chipsets
  • Other advanced applications requiring enhanced thermal and electrical performance