Plastic Ball Grid Array - Multi Die (PBGA-MD)
STATS ChipPAC’s
Plastic Ball Grid Array - Multi-Die (PBGA-MD) packages utilize laminate substrates and are available in a variety of standard JEDEC body sizes and ball counts to meet a wide range of customer requirements. This package provides a cost-effective advanced packaging solution and is a direct extension of our single die product offerings to multi-die configurations. STATS ChipPAC’s PBGA-MD offerings support either side by side and/or stacked die configurations. Advanced design and simulation capabilities are used in these multi-die packaging applications for maximum electrical and thermal performance. STATS ChipPAC combines state of the art processing and equipment with proven material sets to achieve enhanced yield, reliability and performance. Green and lead-free material sets are available for all PBGA-MD package types.
Features
- Full in-house package and substrate design capability
- Full in-house electrical, thermal and mechanical simulation and measurement capability
- Multiple metal layer options for signal, power and ground planes for improved electrical performance
- Flexible body sizes ranging from 19mm x 19mm to 40mm x 40mm
- Accommodates both side by side and/or stacked die configurations
- Multiple chip design and optional passive / discrete components available (SiP)
- 0.80, 1.00, 1.27mm and 1.5mm ball pitch with greater than 1000 I/O available
- Perimeter or full ball array
- Eutectic solder balls (62Sn/36Pb/2Ag)
- Pb-free and green material set options
- JEDEC standard compliant
End Applications
- ASIC
- DSPs and Memory
- Gate Arrays
- Microprocessors/Controllers/Graphics
- PC chipsets
- Other advanced applications involving package level integration of memory and logic devices