Plastic Ball Grid Array - Heat Spreader (PBGA-H)
STATS ChipPAC’s Plastic Ball Grid Array - Heat Spreader (PBGA-H) package is a cost-effective, thermally enhanced version of the PBGA package that features a formed, one piece heat spreader integrated into the mold cap and exposed at the PBGA package surface. This enables further board or system level thermal enhancement by the package end-user. The PBGA-H leverages STATS ChipPAC’s extensive portfolio of tooled PBGA body sizes and ball counts. PBGA-H packages utilize the most advanced design, characterization, and assembly processes and materials available resulting in the industry’s highest quality, reliability, and performance.
Features
- Full in-house package and substrate design capability
- Full in-house electrical, thermal and mechanical simulation and measurement capability
- Multiple metal layer options for signal, power and ground planes for improved electrical performance
- High density routing and tailless substrate technology
- Formed 1 piece, drop-in heat spreader
- Wide range of custom and open tool designs available
- Flexible body sizes ranging from 17mm x 17mm to 40mm x 40mm
- 0.80, 1.00, 1.27mm and 1.5mm ball pitch with greater than 1000 I/O available
- Perimeter or full ball array
- Pb free and green material sets available
- Multiple chip design and optional passive / discrete components available (SiP)
- JEDEC standard compliant
End Applications
- ASIC
- DSP and Memory
- Gate Arrays
- Microprocessors / Controllers / Graphics
- PC Chipsets and Peripherals
- Graphics Processors
- Set-Top Boxes
- Game Consoles
- Gigabit Ethernet
- Others