Plastic Ball Grid Array (PBGA)
STATS ChipPAC’s Plastic Ball Grid Array (PBGA) packages utilize laminate substrates and are available over a variety of standard JEDEC body sizes and ball counts to meet a wide range of customer requirements. This package provides a cost-effective advanced packaging solution, offering higher density over traditional leadframe packages. STATS ChipPAC’s advanced design and simulation capabilities enable package optimizations needed for maximum electrical and thermal performance. STATS ChipPAC combines state of the art processing and equipment with proven material sets to achieve enhanced yield, reliability, and performance. Green and lead-free material sets are available for all PBGA package types.
Features
- Thin, lightweight, space saving package
- Flexible body sizes range from 4mm x 4mm to 23mm x 23mm
- 0.40, 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch
- Eutectic & Pb free solder balls
- Green package available
- Multiple routing layers and dedicated ground/power planes available for improved electrical performance
- BT laminate materials (2 and 4 metal layers)
- JEDEC standard compliant
End Applications
- ASIC
- DSPs and Memory
- Gate Array
- Microprocessors/Controllers/Graphics
- PC Chipsets
- Other advanced applications requiring enhanced thermal and electrical performance