PBGA

Plastic Ball Grid Array (PBGA)

PBGASTATS ChipPAC’s Plastic Ball Grid Array (PBGA) packages utilize laminate substrates and are available over a variety of standard JEDEC body sizes and ball counts to meet a wide range of customer requirements. This package provides a cost-effective advanced packaging solution, offering higher density over traditional leadframe packages. STATS ChipPAC’s advanced design and simulation capabilities enable package optimizations needed for maximum electrical and thermal performance. STATS ChipPAC combines state of the art processing and equipment with proven material sets to achieve enhanced yield, reliability, and performance. Green and lead-free material sets are available for all PBGA package types.


Features

  • Strip molded, cost effective, high I/O package solution
  • Wide range of tooled up body sizes for minimum cost of entry
  • Full in-house package and substrate design capability
  • Full in-house electrical, thermal and mechanical simulation and measurement capability
  • Multiple metal layer options for signal, power and ground planes for improved electrical performance
  • Wide range of custom and open tool designs available
  • Flexible body sizes ranging from 15 x 15mm to 40 x 40mm
  • 0.80, 1.00, 1.27 and 1.50mm ball pitch with greater than 1000 I/O available
  • Perimeter or full ball array
  • Pb-free and green material set options
  • Multiple chip design and optional passive/discrete components available (SiP)
  • JEDEC standard compliant

End Applications

  • ASIC
  • DSPs and Memory
  • Gate Array
  • Microprocessors/Controllers/Graphics
  • PC Chipsets
  • Other advanced applications requiring enhanced thermal and electrical performance