Fine Pitch Land Grid Array (FLGA)
STATS ChipPAC’s FLGA is a laminate substrate based package with plastic overmolded encapsulation. Unlike a standard FBGA, second level interconnect is achieved on the LGA by connecting "lands" on the package directly onto the PCB through solder re-flow. The elimination of solder balls brings better electrical performance and lower package profile without using the more expensive thinner BT core material. It also offers the flexibility of land pattern arrangement in the form of signal lands or heat spreader/ground pads to suit the thermal and electrical requirements of various devices. The FLGA package’s reduced outline and thickness make it an ideal advanced technology packaging solution for high performance and/or portable applications. STATS ChipPAC’s FLGA is available in a broad range of JEDEC standard body sizes including TFLGA (<1.20mm), VFLGA (<1.00mm) and WFLGA (<0.80mm) package thickness.
Features
- Low profile
- Flexible body sizes range from 4 x 4mm to 13 x 13mm
- Flip chip and discrete passive options (SiP)
- Minimum 0.50mm pitch (array and peripheral land pads)
- Flexible land pattern arrangement
- Pb-free and halogen-free compatible materials available
- JEDEC standard compliant
End Applications
- Handheld devices
- Wireless RF
- Analog
- ASIC
- Memory
- Simple PLDs