Fine Pitch Ball Grid Array (FBGA)
STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology packaging solution for high performance and/or portable applications. The use of the latest materials and advanced assembly infrastructure produce a reliable and cost effective package. Lead free and halogen free compatible material sets are available. STATS ChipPAC’s FBGA is available in a broad range of JEDEC standard body sizes with LFBGA (<1.70mm [typically <1.40mm]), TFBGA (<1.20mm), VFBGA (<1.00mm), WFBGA (<0.80mm) and UFBGA (0.55mm max.) thickness. LFBGA-H (with attached heatsink) is qualified for small body sizes.
Features
- Thin, lightweight, space saving package
- Flexible body sizes range from 4mm x 4mm to 23mm x 23mm
- 0.40, 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch
- Eutectic & Pb free solder balls
- Green package available
- Multiple routing layers and dedicated ground/power planes available for improved electrical performance
- BT laminate materials (2 and 4 metal layers)
- JEDEC standard compliant
End Applications
- Microprocessors/Controllers
- Wireless RF
- Analog
- ASIC
- Memory
- Simple PLDs
- Others