BGA & FBGA Package Family
STATS ChipPAC offers the entire family of BGA packaging services in the marketplace today.
| Package |
Configurations |
| EBGA |
EBGA, EBGA-B, EBGA-M, EBGA-MC |
| FBGA |
LFBGA, TFBGA, VFBGA, WFBGA, UFBGA, LFBGA-H |
| FLGA |
TFLGA, VFLGA, WFLGA |
| PBGA |
PBGA, PBGA-H, PBGA-MD |
| TBGA (I / II) |
TBGA I, TBGA II |
Extremely Thin
Array Packages |
XFGBA, XFLGA, X1FLGA |
Ball Grid Array Technology
Array substrate-based packaging represents one of the fastest growing areas in the semiconductor packaging industry and is used primarily in computing platforms, networking, hand-held consumer products, wireless communications devices, personal digital assistants, video cameras, home electronic devices and game consoles.
BGA technology was first introduced as a solution to problems associated with the increasingly high lead counts required for advanced semiconductors used in applications such as portable computers and wireless telecommunications. As the number of leads surrounding the integrated circuits increased, high lead count packages experienced significant electrical shorting problems. BGA technology solved this problem by effectively creating leads on the bottom surface of the package in the form of small bumps or solder balls.