3D / Stacked Die / Stacked Packages
From standard 3D to Advanced Next Generation die and package stacking technologies, STATS ChipPAC offers a broad portfolio of 3D Packaging Solutions
Connecting the Next Generation
Consumers are demanding increased functionality, portability and lower prices for their mobile computing and communication products. To meet this demand, semiconductor companies are turning to 3D integration technology to combine multiple chips with diverse functionality into increasingly smaller and smaller sizes.
Differentiation through 3D Integration
3D packaging provides a high level of functional integration in well established package families including BGAs and leadframe packages, by stacking die or stacking packages or a mix of both, and using a mix of assembly technologies including wire bonding, flip chip, surface mounted components and passive cooling.
The types of 3D packages are often characterized by how they are stacked, as chips, packages or passives. Stacked Die Packages consist of bare die stacked and interconnected using wire bond and flip chip connections in one standard package. The choice of the 3D packaging type is determined not only by the needs of the final product including footprint, profile and cost but the business model of procurement, assembly and ownership of the final module and the value added of the integration.
3D Technology Leader
STATS ChipPAC is a market leader in providing competitive, high performance 3D solutions worldwide to integrated device manufacturers (IDM) and fabless IC design houses. From new product design to high volume manufacturing, STATS ChipPAC ensures a faster time-to-market by offering a solutions-oriented approach rather than just individual technologies or services.
STATS ChipPAC’s solutions for portable consumer electronics and wireless communications devices include die level stacking up to nine dies and package level stacking such as Package-on-Package (PoP), Package-in-Package (PiP) and System-in-Package (SiP) technology that integrates one or more integrated circuits or passives.
Leading through Innovation
STATS ChipPAC’s 3D solutions are found in all leading brands of cell phones, electronic personal assistant devices, personal navigation devices as well as mobile broadband solutions.