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Download STATS ChipPAC Datasheets
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STATS ChipPAC Technology Solutions
3D: Differentiation through Integration
Datasheet
Corporate Backgrounder
Datasheet
Test Solutions Brochure
Datasheet
US Test Services Backgrounder
Datasheet
STATS ChipPAC Taiwan Semiconductor Brochure
Datasheet
Wireless/RF Solutions
Datasheet
Ball Grid Array and Fine Pitch Ball Grid Array Packages
EBGA - Enhanced Ball Grid Array
Datasheet
FBGA - Fine Pitch Ball Grid Array
Datasheet
FLGA - Fine Pitch Land Grid Array
Datasheet
PBGA - Plastic Ball Grid Array
Datasheet
PBGA-H - Plastic Ball Grid Array with Heat Spreader
Datasheet
PBGA-MD - Plastic Ball Grid Array with Multi-Die
Datasheet
TBGA - Tape Ball Grid Array
Datasheet
X-Thin - Extremely Thin Profile Array Packages
Datasheet
Thermally Enhanced Quad Flat Pack and Thin Small Outline Packages
LQFP-ep - Enhanced Low Profile Quad Flat Pack
Datasheet
TQFP-ep - Enhanced Thin Profile Quad Flat Pack
Datasheet
TSOP-ep - Enhanced Thin Small Outline Package
Datasheet
Quad Flat Pack and Thin Small Outline Packages
LQFP - Low Profile Quad Flat Pack
Datasheet
MQFP - Metric Quad Flat Pack
Datasheet
MQFP-d - Metric Quad Flat Pack with Heat Spreader
Datasheet
MQFP-ed - Metric Quad Flat Pack with Exposed Drop-In Heat Slug
Datasheet
TQFP - Thin Profile Quad Flat Pack
Datasheet
TSOP- Thin Small Outline Package
Datasheet
Quad Flat No-Lead Packages and Bump Chip Carrier Packages
QFN - Quad Flat No-Lead Package (punched and saw singulated versions)
Datasheet
BCC - Bump Chip Carrier
Datasheet
Flip Chip Packages
fcBGA - Flip Chip Ball Grid Array
Datasheet
fcCSP - Flip Chip Chip Scale Package
Datasheet
fcQFN - Flip Chip Quad Flat No-Lead
Datasheet
fcPiP - Flip Chip Package-in-Package
Datasheet
Wafer Level Products
WLCSP - Wafer Level Chip Scale Package
Datasheet
CSMP - Chip Scale Module Package
Datasheet
IPD - Integrated Passive Device
Datasheet
Memory Cards
Memory Cards - SD Card, Mini SD, Micro SD, RSMMC, Memory Stick, MS Pro Duo, SD-USB
Datasheet
System-in-Package
IPD - Integrated Passive Device
Datasheet
SiP - System-in-Package
Datasheet
CSMP - Chip Scale Module Package
Datasheet
3D / Stacked Die / Stacked Packages
PiP - Package-in-Package
Datasheet
fcPiP - Flip Chip Package-in-Package
Datasheet
PoP - Package-on-Package
Datasheet
Fi-PoP - Fan-In Package-on-Package
Datasheet
FBGA-SD - Fine Pitch Ball Grid Array with Stacked Die
Datasheet
FLGA-SD - Fine Pitch Land Grid Array with Stacked Die
Datasheet
PBGA-SD - Plastic Ball Grid Array with Stacked Die
Datasheet
QFP-SD - Quad Flat Pack with Stacked Die
Datasheet
TSOP-SD - Thin Small Outline Package with Stacked Die
Datasheet
Package Characterization
Simplified Package Modeling - Electrical (SPM-E)
Datasheet
Simplified Package Modeling - Thermal (SPM-T)
Datasheet
Additional Resources
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