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Download STATS ChipPAC Datasheets
Note:
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Flip Chip Packages
fcBGA - Flip Chip Ball Grid Array
Datasheet
fcFBGA - Flip Chip Chip Scale Package (fcCSP)
Datasheet
fcPiP - Flip Chip Package-in-Package
Datasheet
LCFC - Low Cost Flip Chip
Datasheet
Wafer Level Products
eWLB - Embedded Wafer-Level Ball Grid Array Technology
Datasheet
WLCSP - Wafer Level Chip Scale Package
Datasheet
CSMP-IPD - Chip Scale Module Package / Integrated Passive Device
Datasheet
IPD - IPD Products Databook, 2nd edition
Datasheet
3D / Stacked Die / Stacked Packages
PiP - Package-in-Package
Datasheet
fcPiP - Flip Chip Package-in-Package
Datasheet
PoP - Package-on-Package
Datasheet
Fi-PoP - Fan-In Package-on-Package
Datasheet
Pre-Stacked Package-on-Package
Datasheet
FBGA-SD - Fine Pitch Ball Grid Array with Stacked Die
Datasheet
FLGA-SD - Fine Pitch Land Grid Array with Stacked Die
Datasheet
PBGA-SD - Plastic Ball Grid Array with Stacked Die
Datasheet
QFP-SD - Quad Flat Pack with Stacked Die
Datasheet
TSOP-SD - Thin Small Outline Package with Stacked Die
Datasheet
System-in-Package
SiP - System-in-Package
Datasheet
CSMP-IPD - Chip Scale Module Package / Integrated Passive Device
Datasheet
IPD - IPD Products Databook, 2nd edition
Datasheet
Memory Devices
Removable Flash Memory Cards - SD Card, Mini SD, Micro SD, Memory Stick, MS Pro Duo
Datasheet
Removable USB Flash Drives - USB Module, SD-USB
Datasheet
Ball Grid Array and Fine Pitch Ball Grid Array Packages
FBGA - Fine Pitch Ball Grid Array
Datasheet
FLGA - Fine Pitch Land Grid Array
Datasheet
PBGA - Plastic Ball Grid Array
Datasheet
PBGA-H - Plastic Ball Grid Array with Heat Spreader
Datasheet
PBGA-MD - Plastic Ball Grid Array with Multi-Die
Datasheet
X-Thin - Extremely Thin Profile Array Packages
Datasheet
Thermally Enhanced Quad Flat Pack and Thin Small Outline Packages
LQFP-ep - Enhanced Low Profile Quad Flat Pack
Datasheet
TQFP-ep - Enhanced Thin Profile Quad Flat Pack
Datasheet
TSOP-ep - Enhanced Thin Small Outline Package
Datasheet
Quad Flat Pack and Thin Small Outline Packages
LQFP - Low Profile Quad Flat Pack
Datasheet
MQFP - Metric Quad Flat Pack
Datasheet
TQFP - Thin Profile Quad Flat Pack
Datasheet
TSOP - Thin Small Outline Package
Datasheet
Quad Flat No-Lead Packages and Bump Chip Carrier Packages
QFN - Quad Flat No-Lead Package (punched and saw singulated versions)
Datasheet
QFNs-se - Quad Flat No-Lead Package (sawn, strip etch)
Datasheet
BCC - Bump Chip Carrier
Datasheet
Package Characterization
Simplified Package Modeling - Electrical (SPM-E)
Datasheet
Simplified Package Modeling - Thermal (SPM-T)
Datasheet
STATS ChipPAC Technology Solutions
Corporate Backgrounder
Datasheet
Test Solutions Brochure
Datasheet
STATS ChipPAC Taiwan Semiconductor Brochure
Datasheet
Additional Resources
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