Simplified Package Modeling - Thermal
Extended Simulation Analysis
As demand for complex, non-symmetrical, stacked die, and other multi-chip packages grows, conventional simulation techniques are limited to a small symmetrical section of the package. Simplified Package Modeling (SPM), on the other hand, models a package in its entirety. SPM takes thermal simulation one step further by analyzing not only the package itself, but also analyzes elements such as the underlying printed circuit board and heat sinks.
Reduced Cycle Time
This translates into a distinct advantage for customers with very large and/or complex package designs. Customers receive SPM information at multiple points in the design process, providing an opportunity to make changes before final package design and reducing subsequent design changes or delays. As a result, design cycle time can be dramatically decreased.
Increased Flexibility
SPM provides customers a new level of flexibility and capability especially in combination with STATS ChipPAC’s package design expertise, extensive thermal test database, and Flomerics FLOTHERM simulation tools.
SPM offers customers:
- access to accurate thermal resistance data without waiting for final design drawings
- unmatched design flexibility
- design cycle time reduction
- full package simulation irrespective of complexity and package symmetry