Characterization Services

Characterization Tools

STATS ChipPAC’s worldwide Package Characterization services provide support from centers of excellence located in Singapore, Arizona, and South Korea. Both Singapore and the Arizona location utilize the same simulation tools and techniques to provide consistent data delivery to all customers.


Singapore

STATS ChipPAC’s Package Characterization Center located in our Singapore manufacturing facility offers leading edge electrical and thermal testing and simulation services to customers worldwide, and utilizes state-of-the-art test and simulation tools and equipment. Electrical Simulation Tools
  • Ansoft HFSS (High Frequency Field Solver)
  • Paksi-E (Full Package Solver)

Mechanical Simulation Tools
  • Abaqus (Finite Element Solver)

Thermal Simulation Tools
  • Flotherm v.4.2 (Computational Fluid Dynamics)

Thermal Testing Tools
  • Analysis Tech Phase 10 Semiconductor Thermal Analyzer
  • Automated Device Calibration Bath
  • External DC Power Supply
  • Servo Controlled Wind Tunnel
  • Infrared Thermocouple
  • JEDEC Natural Convection Chamber

Electrical Testing Tools
  • Vector Network Analyser HP8753J

Tempe, Arizona

Conveniently located near North American customers, STATS ChipPAC's Package Characterization Center in Tempe, Arizona features state-of-the-art simulation and modeling tools.
Electrical Simulation Tools
  • Ansoft HFSS (High Frequency Field Solver)
  • Ansoft Designer (System Level Analysis)
  • Ansoft Spicelink (Quasi-static 3D and 2D field solvers)
  • Ansoft Link (Design Translator)
  • Paksi-E (Full Package Solver)
  • IceMAX (Fluent Full Package Solver)
  • EMX (2.5 D field solver for IC level design)

Electrical Testing Tools
  • 8722D Vector Network Analyzer (50MHz - 40 GHz)
  • Advanced Design System Software (interfaces with 872DD Vector Network Analyzer)

Mechanical Simulation Tools
  • Abaqus (Finite Element Solver)
  • Ansys (Multiphysics)

Thermal Simulation Tools
  • Flotherm v.4.2 (Computational Fluid Dynamics)
  • IcePak (Computational Fluid Dynamics)
  • Ansys (Multiphysics)

Thermal Testing Tools
  • Wind Tunnel
  • Various Instrumentation
  • LabView (Test Automation)

Ichon, South Korea

STATS ChipPAC's Package Characterization Center in Ichon, South Korea offers leading edge electrical and thermal testing and simulation services to customers worldwide, provides support to R&D groups and utilizes state-of-the-art test and simulation tools.
Electrical Simulation Tools
  • Ansoft Spicelink (Quasi-static 3D and 2D field solvers)
  • Ansoft Link (Design Translator)
  • TPA (Turbo Package Analyzer)

Mechanical Simulation Tools
  • Ansys 8.0 (Mechanical module)

Thermal Simulation Tools
  • Ansys 8.0 (Mechanical module)

Thermal Testing Tools
  • Analysis Tech Phase 10 Semiconductor Thermal Analyzer
  • Automated Device Calibration Bath
  • External DC Power Supply
  • Servo Controlled Wind Tunnel
  • R-type, T-type Thermocouple
  • JEDEC Natural Convection Chamber
  

Additional Resources

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