Packaging Services

Semiconductor Packaging Services


STATS ChipPAC offers a full suite of assembly solutions to meet your IC packaging needs--from standard plastic, small and thin packages to flip chip bonding, system-in-packaging, advanced stacked die, and multi-chip and multi-package assembly.
Package Families

STATS ChipPAC supports the following package technologies:
  		• Ball Grid Array (BGA) and Fine Pitch Ball Grid Array Packages (FBGA)
  		• Quad Flat Pack (QFP) and Thin Small Outline Packages (TSOP)
  		• Quad Flat No-Lead (QFN) and Bump Chip Carrier Packages (BCC)
  		• Flip Chip Packages (FC)
  		• Wafer Level Products (WLP)
  		• System-in-Package (SiP)
  		• Memory Cards
  		• 3D / Stacked Die (SD) / Stacked Packages (SP)