Leadframe Package Technology

Leadframe Packaging

Leadframe Technology

Leaded packages have been in existence since semiconductors were first produced and are characterized by a semiconductor die encapsulated in a plastic mold compound with metal leads surrounding the perimeter of the package. Leadframe packages are the most widely used package type, employed in almost every electronic application.

At STATS ChipPAC, we provide a comprehensive range of leadframe package solutions--from standard leadframe packages to low profile, small and thin, thermally enhanced packages. STATS ChipPAC's leadframe packages are available in a wide variety of body sizes, lead pitch, and are in standard and green / lead-free bill of materials. Additionally, STATS ChipPAC's leadframe packages are assembled using industry proven materials and technologies to ensure long term performance and reliability.

Quad Flat Packages (QFP)
A QFP is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. QFPs are used primarily for surface mount devices (SMDs). STATS ChipPAC's comprehensive range of quad flat pack options includes:
  • LQFP - a low profile QFP, with thermally enhanced (LQFP-ep) and stacked options (LQFP-SD) available
  • MQFP - a metric QFP, with a thermally enhanced (MQFP-d) option available
  • TQFP - a thin profile QFP, with thermally enhanced (TQFP-ep) and stacked options (TQFP-SD) available
  • TSOP - a thin, small outline package, also available in thermally enhanced (TSOP-ep) and stacked die configurations (TSOP-SD)

Quad Flat No-Lead Packages (QFN)
QFN is a leadframe based, plastic encapsulated chip scale package (CSP) that provides customers with an ideal choice for many applications where size, weight and thermal and electrical performance are important.

STATS ChipPAC's comprehensive range of QFN and DFN options includes:
  • QFNp - a punched singulated package that features a thin, lightweight profile and excellent heat dissipation capability.
  • QFNp-dr - a punched singulated dual row package that features a significantly higher number of I/O terminal pads in a smaller footprint.
  • QFNs-mr - a saw singulated package in a land grid array (LGA) format with square or rectangular body sizes
  • QFNs-st - a sawn singulated stand-off terminal package featuring a significantly higher number of I/O terminal pads than traditional QFN packages.

QFN is available in a variety of JEDEC standard thicknesses, including "very thin" VQFP packages, "very, very thin" WQFN packages, "ultra thin" UQFN packages and "extremely thin" XQFN packages.
 

 

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